available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model BD1631J50100A00 rev b ultra low profile 0805 balun 50 ? to 100 ? balanced description the bd1631j50100aoo is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering 802.11b+g+n, gsm, dcs, pcs and umts. the bd1631j50100aoo is ideal for high volume manufacturing and is higher performance than traditional ceramic and lumped element baluns. the bd1631j50100aoo has an unbalanced port impedance of 50 ? and a 100 ? balanced port impedance*. this transformation enables single ended signals to be applied to differential ports on modern semiconductors. the output ports have equal amplitude (-3db) wi th 180 degree phase differential. the bd1631j50100aoo is available on tape and reel for pick and place high volume manufacturing. detailed electrical specifications*: specifications subject to change without notice. room (25 c) parameter min. typ. max min. typ. max unit frequency 2.0 2.5 1.6 3.1 ghz unbalanced port imp. 50 50 ? balanced port imp.** 100 100 ? return loss 12 17.5 10 13 db insertion loss*** 0.6 0.75 0.75 1.0 db amplitude balance 0.35 0.65 0.7 1.0 db phase balance 2 5 2 5 degrees power handling 2 2 watts features: ? 1.6 ? 3.1 ghz ? 0.7mm height profile ? 50 ohm to 2 x 50 ohm ? 802.11 b & g +n compliant ? low insertion loss ? dcs, pcs & umts compliant ? input to output dc isolation ? surface mountable ? tape & reel ? non-conductive surface ? rohs compliant operating temperature -55 +85 -55 +85 oc * insertion loss stated at room temperature (insertion loss is approximately 0.1 db higher at +85 oc) outline drawing mechanical outline dimensions are in inches [millimeters] tolerances are non-cumulative .049 .004 [1.25 0.10 ] .079 .004 [2.00 0.10 ] 1 2 3 6 5 4 bottom view (far-side) side view top view (near-side) .027 .002 [0.70 0.05 ] 6x .012 [0.30] + rf gnd pin 3 6 1 2 4 5 designation unbalanced port gnd / dc feed balanced port balanced port gnd nc orientation marker denotes pin location orientation marker denotes pin location .026 [0.65] 6x .009 [0.22] .039 [0.98]
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model BD1631J50100A00 rev b typical broadband performance: 0 ghz. to 6.0 ghz.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model BD1631J50100A00 rev b typical performance: 2.4 gh z. to 2.5 ghz.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model BD1631J50100A00 rev b mounting configuration: in order for xinger surface mount components to work opti mally, the proper impedance transmission lines must be used to connect to the rf ports. if this condition is not satisfied, insertion loss, isolation and vswr may not meet published specifications. all of the xinger components are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17 ppm/ o c. an example of the pcb footprint used in the testing of these parts is shown below. an example of a dc-biased footprint is also shown below. in specific designs, t he transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. no bias footprint 0805 standard mounting footprint dimensions are in inches [millimeters] .029 [0.73] 6x .002 [0.05] 6x .011 [0.27] 4x .012 [0.30] plated thru hole to ground 3x transmission line circuit pattern footprint pad (s) solder resist 6x .014 [0.35] part orientation (top view) dc bias footprint dc bias .026 [0.66] 4x .012 [0.30] 6x .013 [0.33] 6x .016 [0.35] part orientation (top view) 0805 dc bias mounting footprint dimensions are in inches [millimeters] 6x .002 [0.05] plated thru hole to ground 3x transmission line circuit pattern footprint pad (s) solder resist
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model BD1631J50100A00 rev b packaging and ordering information parts are available in reel and are packaged per eia 481-2. part s are oriented in tape and reel as shown below. minimum order quantities are 4000 per reel. see model num bers below for further ordering information . b ?a ?c reel dimensions (inches [mm]) ?a b ?c 0.32 [8.0] 2.0 [50.8] 7.00 [177.8] 4000 quantity/reel table 1 ?d 0.512 [13.0] ?d
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model BD1631J50100A00 rev b
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